Fine pitch probes for semiconductor testing, and a method to fabricate and assemble same

ABSTRACT

An apparatus for testing electronic devices is disclosed. The apparatus includes a plurality of probes attached to a substrate; each probe capable of elastic deformation when the probe tip comes in contact with the electronic; each probe comprising a plurality of isolated electrical vertical interconnected accesses (vias) connecting each probe tip to the substrate, such that each probe tip of the plurality is capable of conducting an electrical current from the device under test to the substrate. The plurality of probes may form a probe comb. Also disclosed is a probe comb holder that has at least one slot where the probe comb may be disposed. A method for assembling and disassembling the probe comb and probe comb holder is also disclosed which allows for geometric alignment of individual probes.

CROSS-REFERENCE To RELATED APPLICATIONS

This application claims priority to provisional application No.60/727,039 filed on Nov. 15, 2012 entitled “Fine Pitch Probes forSemiconductor Testing and a Method to Fabricate and Assemble Same.”

FIELD OF THE INVENTION

The apparatus and methods described herein relate generally to finepitch probes, probe cards, and probe card assembly, repair andinspection for testing semiconductor devices.

BACKGROUND OF THE INVENTION

Integrated circuits are made in a bulk parallel process by patterningand processing semiconductor wafers. Each wafer contains many identicalcopies of the same integrated circuit referred to as a “die.” It may bepreferable to test the semiconductor wafers before the die is cut intoindividual integrated circuits and packaged for sale. If defects aredetected the defective die can be culled before wasting resourcespackaging a defective part. The individual die can also be tested afterthey have been cut into individual integrated circuits and packaged.

To test a wafer or an individual die—commonly called the device undertest or DUT—a probe card is commonly used which comes into contact withthe surface of the DUT. The probe card generally contains three uniquecharacteristics: (1) an XY array of individual probes that move in the Zdirection to allow contact with the die pad; (2) an electrical interfaceto connect the card to a circuit test apparatus; and (3) a rigidreference plane defined in such a way that the probe card can beaccurately mounted in the proper location. When the probe card isbrought in contact with the die pad, the Z-direction movement allows fora solid contact with the probe tip.

The probe card ultimately provides an electrical interface that allows acircuit test apparatus to be temporarily connected to the DUT. Thismethod of die testing is extremely efficient because many die can betested at the same time. To drive this efficiency even higher, probecard manufactures are making larger probe cards with an ever-increasingnumbers of probes.

A number of designs and manufacturing technologies have been developedfor the probe card manufacturing industry. One such technology, hereinreferred to as “single probe pick and place” or “pick and place” forshort, has been used for testing semiconductor chips. The typical methodof testing using a “pick and place” system involves testing asemiconductor chip on a common holder and using several tens, hundredsand sometimes thousands of individual probes mounted to said holder totest individual pad of the semiconductor chip. For example, one suchholder comprises one or more rigid plates with individual holes orcavities, so arranged to mirror the patterns of the electrical pads onthe targeted chip or a group of chips. Probes manufactured for pick andplace assembly are often called vertical probes, owing the moniker totheir probe shank extending substantially perpendicular to the uppersurface of the semiconductor chip under test.

U.S. Pat. No. 6,359,454 discloses a pick and place mechanism forassembling a large number of contactors on a contact substrate. The pickand place mechanism includes a first area for positioning anintermediate plate having a plurality of contactors thereon, a secondarea for positioning the contact substrate for receiving the contactorsthereon, a carrier provided between the first and second areas forconverting a direction of the contactor to a predetermined directionwhen receiving the contactor on a seat having an inclined back wall anda flat bottom surface, a first transfer mechanism for picking thecontactor from the intermediate plate and placing the contactor on theseat of the carrier, a second transfer mechanism for picking thecontactor from the seat of the carrier while maintaining thepredetermined direction of the contactor defined by the carrier andplacing the contactor on the contact substrate.

Pick and Place methodology substantially prescribes that probes bemanipulated one at the time. As pad pitch shrinks, several disadvantagesto pick and place can be noted. The handling of ever smaller probes canprove difficult. Furthermore, larger probe counts impacts bothmanufacturing through-put and cost structures, as the assembly time foreach probe head is often proportional to the number of probes requiredby the end application. Shrinking pitch also requires that the realestate dedicated for each electrical pad shrinks as well, making theinsertion of each probe even more difficult. Probe-to-probe positionalaccuracy might also be impacted because shrinking pitch might requiremachining tolerances (e.g. machining a hole for a probe) to shrink aswell. Developments in pulse-laser machining, for example, may addressthis point.

Yet another limitation comes from the manufacturing of the probe holderitself. At smaller pad pitches, it becomes incrementally more difficultto machine individual holes, with individual dividers or walls, toeffectively separate and insulate one probe from the neighboring probe.

Therefore, Pick and Place could benefit from a technology thatfacilitates the handling of small probes and, address the manufacturinglimitations associated with the fabrication of probe holders while, ifpossible, cuts down on the number of pick and place operations.

A competing technology to Pick and Place, is “micro-electro-mechanicalsystems probe technology” (MEMS). MEMS generally refers to a process andsometimes a series of repetitive processes that yield many or all probesnecessary to the testing of a chip or set of chips. For the probe cardindustry, MEMS merely refers to the tools, materials and methodsutilized during the manufacturing of the probe(s). MEMS probes aretypically fabricated on a common holder. Both the probes and holder aretypically assembled along with several other mechanical and electricalparts, not discussed herein, to form a functional probe card. Onepopular MEMS manufacturing approach is based on the creation of a mold,using photosensitive polymers and photolithographic pattern transfer. Inone case, the resulting mold is filled with a metal, using, for example,an electro-deposition process. This process, often followed by anencapsulation step in a temporary filling material and a subsequentlapping step to precisely control the final thickness of theelectroplated material, is sometimes repeated ad libitum, therebycreating as many individual slices or layers as needed to complete aprobe capable to deliver both mechanical and electrical performances asdesigned and required. In its most simple form, the probe substantiallyresembles a miniature diving board. Its “foot” is anchored to thesupporting holder. The other extremity, the “tip,” is free to move inspace, above the holder, above and below a plane substantially parallelto the upper surface of the semiconductor chip under test. For thatreason, MEMS probes are sometimes referred to as horizontal probes, inreference to a vertical probe typically found in a Pick and Placeapproach.

One advantage of MEMS technologies is that arbitrary numbers of probesof varied geometry can, in theory, be fabricated, all at once, on acommon holder. Another aspect of a MEMS approach is that the relativeposition, both in plane and out of plane, of each probe, and especiallythe tip, with reference to the semiconductor chip under test can becontrolled with extremely high precision, in part thanks to thephotolithographic methods employed during fabrication.

Yet, the level of ease, MEMS technologies confer to the manufacturing ofprobes, is not immune to shrinking pad pitch and ever growingprobe-array size. In some cases, shrinking pitch and densely populatedprobe arrays might reduce the real-estate available for designers andmanufacturers to produce individual probes capable of operating bothelectrically and mechanically to the standards and requirements set fortesting the end product. One solution is to build probes that extendvertically, or along an axis orthogonal to the plane defined by theupper surface of the semiconductor chip. Such probes could very wellresemble typical “pick and place” vertical probes, i.e. very tallstructures, sometimes shaped in a “S” or serpentine fashion. Bothaforementioned geometrical attributes are ideal to generate large amountof vertically directed force to contact the electrical pad and/or largeamount of vertical motion, to accommodate any source of pad-to-padnon-planarity at the surface of the semiconductor chip. The fabricationof such taller probes using MEMS can however become prohibitivelycomplicated and, in some cases, limited to the processing capability ofkey ingredients or key manufacturing steps. For example, making verytall probes with MEMS requires several steps because the limitations inthe deposition of fine material. Specifically, if the channel (whichwill become the probe structure) in which fine material is to bedeposited is too deep, then the material will not deposit evenlythroughout the channel, causes the resulting structure to potentiallyhave voids or weak spots. To remedy this problem, the structure can beconstructed in several steps, each building the structure taller. Butthe problem with this is that the several steps required masking, acidand heat steps, and those steps may be misaligned (causing a non-uniformstructure) and the acid/heat steps can cause material fatigue thatcompromises the integrity of the structure when completed.

The probe head manufacturing industry would benefit from a method thatretains some of the most attractive aspects of MEMS, including thepossibility to fabricate more than one probe at the time, and combinethem with some of the most attractive aspects of “Pick and Place,”especially the possibility to manipulate vertical probes, otherwisedifficult to fabricate in-situ using MEMS alone. For example, a tallprobe structure could be constructed horizontally using MEMS (thereforenot problem with fine material deposition) and then pick and placed on asubstrate in the vertical position. Such methods exist and have beenemployed with success to fabricate probe arrays for pitch size as smallas ninety micrometers.

U.S. Pat. No. 6,466,043 discloses a contact structure for testing asemiconductor wafer, a packaged LSI or a printed circuit board that isformed on a planar surface of a substrate by aforementionedphotolithography technology. The contact structure is formed of asilicon base having an inclined support portion created through ananisotropic etching process, an insulation layer formed on the siliconbase and projected from the inclined support, and a conductive layermade of conductive material formed on the insulation layer so that acontact beam is created by the insulation layer and the conductivelayer. The contact beam exhibits a spring force in a transversaldirection of the contact beam to establish a contact force when the tipof the beam portion pressed against a contact target.

U.S. Pat. No. 6,472,890 discloses another method of producing such acontact structure for electrical communication with a contact target.The method includes the steps of providing a silicon substrate cut in acrystal plane, applying a first photolithography process on an uppersurface of the silicon substrate for forming an etch stop layer, forminga first insulation layer on the etch stop layer, forming a secondinsulation layer on a bottom surface of the silicon substrate, applyinga second photolithography process on the second insulation layer forforming an etch window, performing an anisotropic etch on the siliconsubstrate through the etch window for forming a base portion of acontactor, depositing conductive material on the first insulation layerfor forming a conductive layer in a beam shape projected from the baseportion, and mounting a plurality of contactors produced in theforegoing steps on a contact substrate in predetermined diagonaldirections.

U.S. Pat. No. 6,420,884 discloses another contact structure for testinga semiconductor wafer, a packaged LSI or a printed circuit board that isformed of contact beams and a contact substrate. The contact beam isconfigured by a silicon base having an inclined support portion createdthrough an anisotropic etching process, an insulation layer having aplanar shape and formed on the silicon base and projected from theinclined support, and a conductive layer having a planar shape and madeof conductive material formed on one surface of the insulation layer sothat a beam portion is created by the insulation layer and theconductive layer. The insulation layer and the conductive layer havesubstantially the same length. The beam portion exhibits a spring forcein a transversal direction of the beam portion to establish a contactforce when the tip of the beam portion pressed against a contact target.

U.S. Pat. No. 6,232,669 discloses another contact structure forestablishing electrical communication with contact targets with improvedcontact performance including frequency bandwidth, contact pitch,reliability and cost. The contact structure is formed of a plurality offinger like contactors mounted on a contact substrate. Each of thecontactors includes a silicon base having an inclined support portion,an insulation layer formed on the silicon base and projected from theinclined support, and a conductive layer made of conductive materialformed on the insulation layer so that a beam portion is created by theinsulation layer and the conductive layer, wherein the beam portionexhibits a spring force in a transversal direction of the beam portionto establish a contact force when the tip of the beam portion pressedagainst a contact target. An adhesive is applied for bonding thecontactors to the surface of the contact substrate.

U.S. Pat. No. 6,535,003 discloses another contact structure forelectrical connection with a contact target. The contact structure isformed of a contact substrate mounting a plurality of contactors. Eachof the contactors is formed of a silicon base having inclined ends, asilicon beam formed on the silicon base having a support end and acontact end, and a conductive layer formed on a top surface of thesilicon beam. The support end is slightly projected from the siliconbase and the contact end is substantially projected from the siliconbase. The contactor is mounted on the contact substrate such that thesilicon base and the support end are connected to the surface of thecontact substrate through an adhesive, thereby orienting the siliconbeam in a predetermined diagonal direction.

U.S. Pat. No. 7,764,152 discloses a probe card having a plurality ofsilicon finger contactors contacting pads provided on a testedsemiconductor wafer and a probe board mounting the plurality of siliconfinger contactors on its surface, wherein each silicon finger contactorhas a base part on which a step difference is formed, a support partwith a rear end side provided at the base part and with a front end sidesticking out from the base part, and a conductive part formed on thesurface of the support part, each silicon finger contactor mounted onthe probe board so that an angle part of the step difference formed onthe base part contacts the surface of the probe board.

U.S. Pat. No. 8,097,475 discloses a probe card having a plurality ofsilicon finger contactors contacting pads provided on a testedsemiconductor wafer and a probe board mounting the plurality of siliconfinger contactors on its surface, wherein each silicon finger contactorhas a base part on which a step difference is formed, a support partwith a rear end side provided at the base part and with a front end sidesticking out from the base part, and a conductive part formed on thesurface of the support part, each silicon finger contactor mounted onthe probe board so that an angle part of the step difference formed onthe base part contacts the surface of the probe board.

U.S. Pat. No. 8,241,929 discloses a contactor and an associated contactstructure, probe card and test apparatus. The contactor may include abase part having three or more steps in a stairway state, a support partwith a rear end side provided at the base part and a front end sidesticking out from the base part, and a conductive part formed on asurface of the support part and electrically contacting a contact of adevice under test.

U.S. Pat. No. 8,237,461 discloses a contactor includes conductive partsfor electrical connection with input/output terminals of an IC device;beam parts with the conductive part provided on their main surfaces; anda base part supporting the beam parts in a cantilever manner, the basepart has a support region supporting the beam parts and mark formationregions at which first positioning marks are provided, and weakenedparts relatively weaker in strength than other parts of the base partare provided between the support region and mark formation regions.

The Applicants hereby disclose a probe design, probe fabrication and aprobe head assembly method poised to leverage some of the mostattractive aspects of both “Pick and Place” and MEMS, while bridgingsome of their respective short-comings. The disclosed probe designcombines at least two MEMS probes into one, thereby potentially reducingby a minimum factor of two the number of probes typically handled using“Pick and Place” designs. Also disclosed is an assembly method, based ona reconfigurable probe holder, compatible with “Pick-and-Place” handlingoperations, yet capable of yielding high probe count, small pitch probeheads with potentially micron to sub-micron positional accuracy, at thepitch of interest.

SUMMARY OF INVENTION

The present application provides a novel apparatus for use in testingsemiconductor devices that addresses the shortcomings of the prior artby allowing the probe to bend while maintaining adequate probe to probepositional accuracy during contact with the device under test (DUT). Theapparatus includes a plurality of probes, each probe having a shank anda probe tip located at the distal end of the shank, wherein the shankelastically deforms when the probe tip contacts the DUT. The apparatusalso has a common foot connected to proximal end of each shank, the footis capable of elastic deformation when the probe tip contacts the DUT,and a substrate connected to the common foot. A plurality of isolatedelectrical vertical interconnected access (vias) connect each probe tipto the substrate, such that each probe tip of the plurality is capableof conducting an electrical current from the DUT to the substrate.

The plurality of probes may form a probe comb, and that probe comb maybe inserted into a probe comb holder. The probe combs may also have aspring or set of springs that helps maintain the position of the probecomb within the probe comb holder, thus maintain the accurate positionof the probe tips located on the probe comb.

Further disclosed is a novel probe comb holder that can receive, andhold the probe combs. The probe combs can be easily inserted into theprobe comb holder, and with the use of alignment structures can selfalign the probe tip into the proper location. The probe comb holder mayinclude a number of plates that slide relative to each other andrestrict the movement of the probe comb.

Further disclosed is a method for inserting the probe comb into theprobe comb holder, then fixing the probe comb into the probe combholder. This method can be reversed to remove the probe comb, in casethe probe comb is damaged and needs to be replaced.

Other systems, methods, features and advantages of the invention will beor will become apparent to one with skill in the art upon examination ofthe following figures and detailed description. It is intended that allsuch additional systems, methods, features and advantages be includedwithin this description, be within the scope of the invention.

BRIEF DESCRIPTION OF THE FIGURES

The forgoing and other aspects, objects, features and advantages of themethod and system disclosed will become better understood with referenceto the following description, claims, and accompanying drawings, where:

FIG. 1A illustrates two novel probes according to the present invention.

FIG. 1B illustrates the common foot of the two probes of FIG. 1A.

FIG. 1C illustrates the two probes of FIG. 1A affixed at the foot tostructure substrate.

FIG. 2A illustrates of another embodiment of two novel probes accordingto the present invention, with multiple regions with varying stiffness.

FIG. 2B illustrates of another embodiment of two novel probes accordingto the present invention, with multiple regions with varying stiffness.

FIG. 3 models two probes as springs to describe the elastic deformationcapability of the probes.

FIGS. 4A-4D illustrates the contact between the probes and the pads of asemiconductor chip under test.

FIG. 5 illustrates a further embodiment of the probes where theconductive layer is deposited, attached, or otherwise affixed to atleast one side of the probe.

FIG. 6A illustrates a double comb probe design.

FIG. 6B further illustrates the characteristics of a double comb probedesign.

FIG. 7 illustrates a double comb probe design with electronic circuitry.

FIG. 8A illustrates one process which can be used to manufacture probes.

FIG. 8B illustrates a probe cut-out from following the stamping process.

FIG. 8C illustrates a probe cut-out following the etching process.

FIG. 8D illustrates a probe design where conductor lines partiallyrelease from alumina substrate.

FIG. 9A illustrates a comb probe without springs.

FIG. 9B illustrates a comb probe with springs only at one end of thecomb.

FIG. 9C illustrates a comb probe with springs at both ends of the comb.

FIG. 9D illustrates a comb probe with lateral and vertical springs atboth ends of the comb.

FIG. 9E illustrates a comb probe with lateral and vertical springs atboth ends of the comb with the comb subjected to a downward force.

FIG. 10A illustrates a plate with a slot configured to accept a portionof a probe comb.

FIG. 10B illustrates a plate with a probe comb inserted into the slot onthe plate.

FIG. 11 illustrates a plate with a plurality of slots configured toaccept a portion of a plurality of probe combs.

FIG. 12 illustrates a side cut-away view of a probe comb inserted into aslot on a plate.

FIG. 13A illustrates a side cut-away view of a probe comb inserted intoa probe comb holder that comprises three plates.

FIG. 13B illustrates a side cut-away view of a probe comb inserted intoa probe comb holder, where one of the plates is used to align the probecombs.

FIG. 13C illustrates a side cut-away view of a probe comb inserted intoa probe comb holder, where three of the plates are used to align theprobe combs.

FIG. 14 illustrates a probe comb holder which allows probe comb motionin a vertical direction.

FIG. 15 illustrates a planar surface of the probe comb holder with aplurality of slots etched into the surface.

FIG. 16 illustrates a planar surface of the probe comb holder with aplurality of slots etched into the surface where each slot is flanked bya series of triangular cuts.

FIGS. 17A-17E illustrate a side cut-out view of the insertion of a probecomb into a probe comb holder.

FIG. 18 illustrates a side cut-view of an aligned probe comb insertedinto a probe comb holder where downward force is applied to makeelectrical contact between the probe comb and an array of electricalpads on the probe comb holder.

FIG. 19 illustrates a side cut-view of an aligned probe comb insertedinto a probe comb holder where downward force is applied to makeelectrical contact between the probe comb and an array of electricalpads on the probe comb holder, where the top plate is pulled rather thanbeing pushed to avoid bowing or buckling of the probe combs.

FIG. 20 illustrates a further embodiment of a probe comb holder.

FIG. 21 illustrates a further embodiment of a probe comb holder.

FIG. 22 is a flowchart showing a method of assembling an apparatus foruse in testing electronic devices, where the apparatus contains both aprobe comb and probe comb holder.

FIG. 23 is a flowchart showing a method of disassembling an apparatusfor use in testing electronic devices, including steps for replacingspecific probe combs and reassembling the apparatus.

DETAILED DESCRIPTION

Herein is disclosed a probe card design comprising an array or pluralityof probes electrically isolated, mechanically joined near the foot,forming a common foot, yet capable of operating mechanically, e.g.bending independently from one another. The following is a list ofdefinitions for terms used in this disclosure:

PROBE: In this application, a probe is a structure which conductselectrical signals from one end, herein referred to as the “foot” to theother end, herein referred to as the “tip” for the purpose of testingsemiconductor chips. The tip is typically pressed against the electricalpad of the chip under test. The portion between the tip and the foot isherein referred to as the probe shank.

COMB: In this disclosure, a “comb” will refer to one or more probesco-fabricated, affixed or otherwise mounted on a common mechanicalstructure. Among other functions, a comb provides a means to handle oneor more probes at the same time.

PAD: In this disclosure, a “pad” refers to an electrically conductiveportion of a semiconductor chip designed to transmit an electricalcurrent to one or more internal components of the chip. A pad oftenrefers to a square pad of aluminum, the upper surface of a verticalcopper pillar used in flip-chip bonding, or a semispherical structuremade of any number of soldering alloys. Pads can be arranged in anynumber of fashions. A grid layout, with center-to-center distancebetween two pads substantially equal to or bigger than 90 μm is one suchpossible arrangement. Other possible grid layouts include patchworks ofregions at a pitch substantially equal to or larger than 90 μminterleaved with regions with a pitch substantially equal to or smallerthan 90 μm, including 65 μm, 50 μm, 45 μm, 40 μm or below. Suchinterleaved grid layouts will be referred to a “mixed” pitch. The gridelementary cell might be square. It might be rectangular or hexagonal aswell.

PROBE CARD: In this disclosure, a “probe card” comprises at least oneprobe head temporarily or permanently mechanically affixed to at leastone structure which provide a means to send and receive electricalsignals, from an auxiliary electronics system, including but not limitedto a voltmeter and a power supply, all the way to the tip of individualprobes, and, for example, elicit an electrical response from the chipunder test.

OVERDRIVE: An important probe card performance trait pertains to theprobe's ability to elastically deflect or deform in a known andrepeatable fashion, when the probe head is pushed against a chip fortesting purposes. The amount of motion along a line substantiallyorthogonal to the plane of the chip under test is referred to as the“overdrive.” A “nominal” overdrive refers herein to the overdriverecommended by the designer or the probe manufacturer during typicaloperations. When forced to bend to nominal overdrive, the probe exerts areactive force on the electrical pad via the tip. It is commonly assumedthat the direction of the force is substantially orthogonal to thesurface of the electrical pad.

PROBE TO PROBE MECHANICAL AND ELECTRICAL INTERFERENCE: While bending,various points along the probe shank might move the probe closer to orfarther away from other surrounding probes. In some instances, it isimportant to avoid or control the amount of mechanical or electricalinterference that neighboring probes might develop, during testing.

SCRUB MARK: Another important probe card overall trait pertains to thelength, depth and width of the scrub mark. A scrub mark is defined asthe mark the probe tip leaves at the surface of the chip electrical pad,once the probe head retracts from the chip and the electrical test forthat particular chip is finished.

CURRENT CARRYING CAPABILITY or CCC: Another important trait pertains tothe probe's ability to carry amounts of current ranging from less thanfew milliamperes to several amperes. The ability to carry current isherein referred to as the current carrying capability.

REPAIRABILITY: Another important trait pertains to the possibility torepair or replace one or several probes independently from other probes.

TIP PLANARITY: Another important trait pertains to the tip planarity,herein defined as the spatial location above and below a planesubstantially parallel to the chip.

TIP LOCATION: Another important trait pertains to the tip location,herein defined as the tip spatial location with reference to thegeometrical center of the electrical pads at the surface of the chipunder test.

Now turning to the figures, FIG. 1A depicts one such probe array 100,comprising a probes 101 and 102, each of which comprises a shank (103and 104) with a probe tip (105 and 106) located at the distal end of theshank, and a foot (107 and 108) connected to proximal end of each shank.The shank is capable of elastic deformation when the probe tip contactsa device under test (DUT). The foot (107 and 108) is also capable ofelastic deformation when the probe tip contacts the DUT.

As describe below with reference to FIG. 1B, the probe array 100 whenused as part of a probe card is affixed to a substrate. The probe alsocomprises a plurality of isolated electrical vertical interconnectedaccess (vias) connecting the each probe tip to the substrate, such thateach probe tip of the plurality is capable of conducting an electricalcurrent from the DUT to the substrate. A physical insulating structure109, made of electrically non-conductive material, adjoins probe 101 toprobe 102. The insulating structure 109 serves both to insure that bothprobes 101 and 102 are electrically isolated, yet keeps them adjoined sothat they can be, at least partially, manipulated as one entity. Freespace 110 separates probes 101 and 102 near the distal end. In oneparticular embodiment, the free space 110 extends down to the middle ofthe probe shank (103 and 104). A free space 110 separates the feet (107and 108) of probes (101 and 102). In one example, probes 101 and 102 aremade of conductive materials, including but not limited to copper, gold,nickel, nickel manganese, beryllium copper, etc. In another embodiment,probe 101 and probe 102 is made of a single crystal silicon. In oneexample, tips (105 and 106) can be made of a material substantiallysimilar to the material forming the shank (103 and 104) of either orboth probes (101 and 102). In another embodiment, the tips are made of adifferent material, including but not limited to rhodium. In oneembodiment, structure 109 is made of a polymer. In another embodiment,insulating structure 109 is made of electrically non-conductive ceramic,including, but not limited to alumina. In yet another embodiment,structure 109 is made of glass, including but not limited to thermallygrown Silicon-dioxide (SiO2).

FIG. 1B illustrates a common foot 111 complex that is comprised of thefoot (108 and 107) of each probe (101 and 102), along with the structure109. As is described below, this common foot 111 can elastically deformwhen the probe tips come into contact with the DUT and provide part ofthe compliance of the probe array.

FIG. 1C represents probe array 100 affixed to a substrate 120. Both foot107 and 108 are affixed to the substrate 120 using a permanent ortemporary bonding material 121 and 122. The substrate 120 is a solid(usually planar) substance onto which a layer of another substance isapplied, and to which that second substance adheres. In solid-stateelectronics, this term refers to a thin slice of material such assilicon, silicon dioxide, aluminum oxide, sapphire, germanium, galliumarsenide (GaAs), an alloy of silicon and germanium, or indium phosphide(InP). These serve as the foundation upon which electronic devices suchas transistors, diodes, and especially integrated circuits (ICs) aredeposited.

In one example, bonding material 121 and 122 is a solder compound,including, but not limited to tin (Sn)-gold (Au) alloys, tin (Sn)-gold(Ag)-silver (Cu) alloys, etc. Once probes 101, 102 are anchored to thesubstrate 120, the forces (represented by the arrows 124 and 125)generated when a semiconductor pad is pressing against probe tips (105and 106) will cause the probes 101 and probe 102 to deform. Adequatedesign rules must be used to insure that the stress resulting from theapplication of a force do not result in plastic deformation, permanentdeformation or even destruction of probes 101 and 102. An importantaspect pertains to design of the probes 101 and 102 as well as thedesign of the free space 110. For example, the free space 110 can bedesigned to extend from the tips 105 and 106 along the shanks (103 and104). Depending on the design of probes 101 and 102, the size of thefree space 110 might dictate how much probe 101 can bend or deformindependently from probe 102.

FIG. 2A is an embodiment of the probe array incorporating two regions ofdeflection in the common foot. Unlike the probe array 100 describe withrespect to FIGS 1A through 1C, here the probe array 200 contains angleswithin the individual probes 201 and 202. Probes 201 and 202 may beconnected to a substrate, although this is not illustrated in FIG. 2A.In the example depicted in FIG. 2A, probes 201, 202 can be subdivided inthree distinct sections 203 (upper section), 204 (middle section) and205 (lower section) delimited by the angles in probes 201 and 202. Theupper section 203 represents the part of probes (201 and 202) which arefree to move independently, due to the presence of a free space 110between probes. Section 204 represents a part of probes (201 and 202)where the probes are affixed to one another by insulating structure 109and are expected to move in unison. In this example, section 205, isalso a region where both probes are affixed to the insulating structure109 and therefore move as one structure. The inherent springcharacteristics make section 205 more rigid than both section 203 andsection 204. That is, the different sections, or regions, have adifferent stiffness.

In addition to the angles separating the section, it is also possible tohave the insulating structure 109 have two separate regions made up ofdifferent materials. This is shown in FIG. 2B, insulating structure 109has two regions 210 and 211 made up of two different materials, andthose materials may each have a different stiffness. The probe arraywith an insulating material of different stiffness may or may notinclude the angular bends shown in FIGS. 2A and 2B.

Based on the flexible nature of the probes, the system can be modeled asmechanical springs connected either in series or in parallel. Thischaracterization provides more insight regarding the sought aftermechanical mode of operation of the probe design herein disclosed. Thespring-based representation is depicted in FIG. 3. Section 203 of probe201 is represented by a spring 301, while section 203 of probe 202 isrepresent by a spring 302. Section 204 of probes 201 and 202 arephysically adjoined and can therefore be represented using a singlecommon spring 303. Both springs 301 and 302 are connected to spring 303.The other end of spring 303 is affixed to structure 307, considered asinfinitely rigid in this example. As will be appreciated by those ofskill in the art, structure 307 may be designed to less stiff—i.e., morebendable—in which case structure 307 would also be represented by aspring. This design is shown above with respect to FIG. 2B. Also thespring 303 and structure 307 represent/model the common foot 111.

Both free ends of spring 301 and 302 are terminated with a trianglerepresenting tips 105 and 106 respectively. The spatial movement ofeither tip 105 or 106 can be characterized by the spring model depictedin FIG. 3 with the tip movement a function of the deflection of allthree springs. However, it is conceivable that one versed in the art,could design spring 301, 302 and 303 so that a certain levels of forcesapplied to the free end of one spring alone would not result in anysignificant movement of the free end of the second spring.

The probe array with a common foot describe herein may be used withcantilever probes, torsional probes and hybrid probes.

For probe card designs it is desirable to maintain a certain amount ofmechanical independence for each probe. Semiconductor chips aretypically very flat. Although it is reasonable to expect electrical padsto be coplanar within a few micrometers, debris, missing pads, etc.might contribute to local and sometimes transient or temporarynon-planarity. FIG. 4A depicts the tips (105 and 106) of probes (101 and102) prior to making contact with the semiconductor pads. A local nonplanarity at the surface of the semiconductor chip is represented by astep structure 401. FIG. 4B illustrates the moment when the stepstructure first touches one of the tips 106. FIG. 4C illustrates themoment when the step structure 401 has been pushed down by a distancesubstantially equivalent to 80% of the step height. Note that probe 102has deflected significantly, while probe 101 has not appreciablydeflected. Finally, FIG. 4D illustrates the moment when the stepfunction has moved more than hundred percent of the step height. At thismoment, both tips 105 and 106 are making contact with a surface of thestep structure 401. The bending characteristics of probes 101, 102 allowfor all probes making contact with the semiconductor pads despite thepresence of the non-planarity.

FIG. 5 depicts a probe array 500, comprising two probes, 101 and 102,made of single crystal silicon. An electrically insulating layer, 501and 502, is deposited, attached or otherwise affixed to at least oneside of probe 101 or probe 102. In one embodiment, insulating layers 501and 502 can be made of silicon dioxide. The thickness of insulatinglayer 501 and 502 may range from a fraction of a micrometer to severaltens of micrometers, to several millimeters. Conductive lines 503 and504 are deposited, attached or otherwise affixed to insulating structure501 and 502 respectively. The mass of the conductive lines may beselected so as to provide compliance to the probe such that the probecan elastically deflect. Probe designers must consider the followingaspects of such probe card: mechanical design of both probes 101 and102, insulating layers 501 and 502, conductive lines 503 and 504, aswell as free space 110 and insulating structure 109, in order toguarantee adequate overdrive, force, lateral movement, scrub length ofthe tip, etc.

FIG. 6A represents an array of probes 600 configured as two banks ofparallel probes 601 and 602, each bank, herein referred to as a probecomb, attached by a isolating structure 603, which also serves to joinprobe combs 601 and 602. It is possible to pair more than two probecombs at a time resulting in an array of probes all in geometricalignment. FIG. 6A represents only one of many possible configurationsfor probe comb designs, materials, total number of probes, etc. In oneembodiment, both probe combs 601 and 602 are made out of Single CrystalSilicon (SCS). In this example, probe combs 601 and 602 are coated withan electrically non-conductive layer 604 and 605. The layers (604 and605) are affixed to a probe comb scaffold (609 and 610), one for eachprobe comb, said scaffold is preferably non-conductive. Electricalconductive lines 606 (i.e. vias) are affixed, mounted or otherwiseattached to the non-conductive layer. Insulating structure 603 may bemade from silicon dioxide, and adjoin the scaffold (609 and 610). Arrow607 represents the average distance between the probe tips, affixed on asame probe comb. Arrow 608 represents the minimum distance between probetips from separate probe combs. When considering a hypotheticalapplication targeting a pitch arbitrarily set to 50 μm in the followingexample, it follows that the distance 607 and 608, between neighboringtips shall be substantially equal to 50 μm. Distance 608 may be designedto be the sum of: half of the thickness of the probe tip, the thicknessof electrically nonconductive layer (605), the thickness of probe combscaffold (610), the thickness of insulating structure (603), thethickness of probe comb scaffold (609), the thickness of nonconductivelayer (604) and half the thickness of the probe tip. In oneconfiguration, the tip thickness is four (4) micrometers, thenonconductive layer thickness is one (1) micrometer, the probe combthickness is twenty (20) micrometers, the insulating structure thicknessis two (2) micrometers, the second probe comb thickness is twenty (20)micrometers, the second nonconductive layer is one (1) micrometer, andthe second tip is also four (4) micrometers.

FIG. 6B further illustrates the combined probe comb structure of FIG.6A. Distance 620 represents the extent to which the shoulder 621protrudes on either side of probe comb 601 or 602. Distance 620 can varyfrom zero to several tens of millimeters. Distance 630 represents theaverage distance to which tips, extends beyond the free end of onefingers of the probe comb scaffold. Distance 630 can vary from a zero toseveral millimeters, if necessary.

Although FIGS. 6A and 6B represent probe combs with individual probessubstantially aligned and identical in size and structure, it isimportant to note that this design is also applicable to probe combswith non-symmetric probes. An important aspect pertains to themanufacturing of such double probe combs and will be described in thelater in the disclosure.

Electrical elements, including but not limited to resistors, inductors,thermocouples, or resistive heaters can be incorporated, affixed orotherwise added to one or both probe combs. FIG. 7 depicts one suchcase, where a double probe comb 700, similar to double probe comb 600from FIG. 6A or 6B, is fitted with a resistive heaters, made of, forexample, a thin film of nickel properly patterned and dimensioned toresult, for example, in a meandering structure 701, terminated by twolarger areas 702, 703 made of the same metal. Under specific levels ofcurrent determined by one skilled in the art, current allowed to flowbetween areas 702 and area 703, via meandering structure 701 generatesheat and maintains or raises the temperature of probe comb 700. Thisfeature could, for example, be used in conjunction with a solder reflowprocess, to anchor probe comb 700 to a substrate, not represented inFIG. 7.

An important aspect pertains to the manufacturing or the techniquesemployed to fabricate a probe composed of two probes, akin to probearray 100, or a series of probes, akin to probe array 700. A number oftechniques can be used to manufacture these arrays. One possiblefabrication process is described in FIGS. 8A through 8C. The first step801 represents the action of laminating, i.e., pressing with the intentto create a strong, durable mechanical bond, two foils of BerylliumCopper to a foil of polyimide. The permanent bond can be obtained using,for example, a thin layer of adhesive material. Once laminated, thethree-layer part is subjected to a stamping process, annotated 802,i.e., a process during which a small portion of the three layer part iscut out, using a stamp or a die of arbitrary shape. Structure 803 is anexample of a cut out resulting from the aforementioned stamping step.Structure 803 bears many resemblances with sought after structure 100from FIG. 1, with some exceptions, including the absence of a negativespace between two of the three layers 804, 805, 806. If necessary, alocalized etching process can be applied and so directed as to partiallyremove layer 805. Structure 810 is one embodiment of the resultingstructure following the etching process.

Structure 810 can be fabricated using a flex circuit and front and backmicromachining, to pattern conductor lines. Structure 810 can also befabricated using alumina substrate in conjunction with a front and backmicromachining to pattern conductor lines. In one embodiment, theconductor lines are fabricated using a mechanically resilient material,including but not limited to Nickel-Manganese (NiMn), Nickel-Iron(NiFe), Nickel-Cobalt (NiCo), etc. In one embodiment illustrated in FIG.8D, the conductor lines are partially released from the aluminasubstrate, to allow the conductor line to act as a mechanical spring.

In another embodiment, the probe combs can be equipped with mechanicalsprings on one, either, or both ends of the probe comb. FIG. 9Arepresents a probe comb 900 without springs, but with shoulders 915 and916. The purpose of these shoulders will be described below. FIG. 9Brepresents a probe comb 901, comprising a probe comb with a spring 902on one end only. Spring 902 allows for compliance in the direction ofarrow 903. FIG. 9C represents such a similar structure 904 with twosprings 902 and 905, allowing for compliance in the direction of arrows903 and 906 respectively. FIG. 9D represents a structure 907 similar toprobe comb 901, with additional springs 908 and 909 attached to bothshoulders and that can operate in a direction substantiallyperpendicular to either springs 902 or 904, allowing for compliance inthe direction of arrows 910 and 911. FIG. 9E represents probe comb 907subjected to a downward force 912, forcing spring 908 and 909 to bendand deform. The amount of deformation is a function of the springconstant of springs 908 and 909 and the downward force 912.

The purpose of mechanical springs 902 and 904 will become apparent, asthe disclosure now focuses on a means to group and arrange more than oneprobe comb to form a complete probe card. It is understood that mostmodern probe cards comprise up to several thousands of probes.

In one example, a plate with well-defined electrical, mechanical andgeometrical attributes, including thickness, type of material, etc. isso machined to create a series of grooves, wide enough to accommodatethe insertion of a predetermined portion of a probe comb. FIG. 10Arepresents such a plate 1000, as well as a probe comb 900, just prior toprobe comb 900 being placed within slot 1001. FIG. 10B represents theplate 1000 and probe comb 900 at the end of the assembly step, at whichpoint probe comb 900 is partially inserted within slot 1001. Shoulders915 and 916, on both sides of probe comb 900 limit the progress of probecomb 900 though slot 1001.

FIG. 11 illustrates a plate with two slots. Each slot is designed toreceive an individual probe comb. By extension, using this method,plates with arbitrary numbers of slots can be fabricated, leading to theassembly and collocation of a number of probe combs equivalent orsmaller than the number of slots available on the plate. It should alsobe apparent that multiple probe combs can be placed within a singleslot.

FIG. 12 represents a both probe comb 900 and a plate 1000 in crosssection view. Distance 1200 represents the amount of play, i.e. thedifference between the width of probe comb 900 and the width of slot1001. A certain amount of play is necessary to allow for probe comb 900to be inserted in slot 1001. It is understood that a larger value ofplay will make it easier for inserting the probe comb 900 into a slot1001.

Too much play, however, can prove however detrimental to probe alignmentand probe stability. In one case, too much play might hinder the precisealignment of one probe comb with reference to its neighbors, in theevent that more than one probe comb is to be assembled on a singleplate. Too much play might also allow any given probe comb to movewithin a slot and, under the right set of circumstances, get dislodged,unless otherwise affixed to the plate, after the probe comb has beeninserted.

The present application discloses a plate or, in more general terms, aprobe comb holding system that (a) facilitates the placement ofindividual probe combs, (b) can host an arbitrary number of probe combs,(c) can insure an adequate degree of probe comb-to-probe comb positionalaccuracy. FIG. 13A and 13B offer a cross-sectional representation ofsuch a probe comb holder 1300, comprised of three plates verticallystacked on top of each other. Although not depicted in detail in FIG.13, it is to be understood that at least one plate can moveindependently from the other two plates. FIG. 13A illustrates the stateof the probe comb holder 1300 when a single probe comb is inserted allthe way into a slot. At that time, the probe comb is substantially freeto move within the allotted slot. FIG. 13B illustrates the moment whenone of the three plates has been pushed laterally along the direction ofthe long edge of the plate, until one edge of the plate slotmechanically engages with the probe comb(s). FIG. 13C represent thestate of the probe comb holder 1300 after the other side of the probecomb has been pushed laterally against the two other plates. At thatmoment, the probe comb freedom to move laterally within the slot isrestricted.

In the event that more that more than one probe comb are assembled, andassuming that the play between each probe comb and their respective slotis perfectly controlled, the steps described in FIGS. 13A, B and C willresult in precisely aligning all probe combs at once. It is howeverreasonable to expect that the dimensions all key geometrical attributesmight vary from one probe comb to another. Slots and probe combs mightsuffer from such variability, arising, for example, from tolerances anygiven machining or micromachining method might afford. It is thereforean object to disclose a probe comb and a probe comb holder that helpsaccommodate such dimensional variability and participate to produce acomplete probe comb holder that exhibits all in-plane positionalfeatures, as prescribed by the end application. FIG. 14 represents onesuch solution for a probe comb holder 1400.

In one embodiment as depicted in FIG. 14, probe comb holder 1400comprises three holding plates 1401, 1402 and 1403. One plate, plate1402, is so machined to allow a certain amount of play and movement,independent from the two other plates. This play, or movement, isrepresented by the double arrow 1404. All three plates are mechanicallyaligned with reference to plate 1405 using a plurality of alignment pins1406 and 1407. Mechanical springs 1408, comprising, but not limited to,helical stainless steel coils or parallelepipeds of compliant material,such as rubber, are inserted between plate 1403 and plate 1405. The playbetween alignment pin 1406 and 1407 and plate 1402 is larger than theplay between both aforementioned pins and the other two plates 1401 and1403, conferring plate 1402 with a greater range of in lateral platemotion, relative to plate 1405, when compared with that of plates 1401and 1403.

Plate 1405 is equipped with an electrical structure comprising a seriesof electrical pads 1409 on one side, and several layers of metal andinsulators 1410, designed to redistribute or fan out the electricalconnecting terminals on the bottom side of plate 1405. These electricalconnecting terminals may be connected to diagnostic equipment 1450,thereby providing the diagnostic equipment 1450 an electrical connectionto the DUT. At this point, the diagnostic equipment 1450 may run test onthe DUT to determine if the DUT is operating properly.

In one embodiment, plates 1405, 1401, 1402 and 1403 are made of singlecrystal silicon. In another embodiment, all aforementioned plates aresubjected to a series of etching and deposition steps, congruent withthose routinely used for the fabrication of MEMS and semiconductorstructures.

In one embodiment, plates 1401, 1402 and 1403 have individual slots foreach individual probe comb. FIG. 15 illustrates an example of a seriesof slots that may be etched into these plates. Specifically, FIG. 15illustrate slots 1510 etched into a plate 1520, along with holes 1530that may accept alignment pins 1406 and 1407. In another embodimentillustrated in FIG. 16, plates 1401, 1402 and 1403 have a single opening1610 flanked by a series of triangular cuts 1620. Into each of thesetriangular cuts a single probe comb may be ultimately disposed, suchthat slot 1610 can accommodate four probe combs. These triangular cutsform a self alignment structure that self-align the probe comb such thatwhen the probe comb is fixed to the probe comb holder the probe tips arealigned in their proper position.

FIGS. 17A, 17B, 17C, 17D and 17E represent the insertion of a probe comb1701 into the probe comb holder 1710. These figures illustrate theprocess of the mechanical insertion of a probe comb 1701 (FIGS. 17A and17B), the sliding of plate 1402 to adjust the position of probe comb1701 with reference to plate 1405 (FIG. 17C), the application of adownward force to bring the bottom part of probe comb 1701 in contactwith the electrical pads 1409 on plate 1405 (FIG. 17D) and finally athermal treatment that results in permanently affixing, bothelectrically and mechanically, probe comb 1701 to plate 1405 (FIG. 17E).

In one example, probe comb 1701 comprises two series of springs, severallayers of insulating and conducting materials to substantially mimic themechanical and electrical structure of probe comb 600, describe earlier.In one embodiment probe comb 1701 comprises solder balls orsolder-coated electrical terminals 1702 as depicted in FIG. 17A.

Forces can be applied directly to the probe comb, away from the probeshank. Alternatively as illustrated in FIG. 18, a separate plate can betemporarily aligned, using the alignment pins, and downward pressureapplied against the springs.

In another example, probe comb 1701 is pulled vertically down, ratherthan being pushed, by plate 1402, to make electrical contact between theprobe comb pins and the plate 1405. This method offers the advantage toapply a certain amount of tensile forces on probe comb 1701 (as well asany other probe comb co-assembled in the same probe comb holder),thereby any bow or buckling is avoided. An example of a plate designedto pull rather than push on a probe comb is represented in FIG. 19.Spring 1901, integrated along with probe comb 1701, is pulled anddeformed as a result of tensile forces 1902 is applied to plate 1402 andforce 1903 is applied in the opposite directly to both plates 1401 and1403. It should be noted that plate 1402 hooks around the probe comb1701 at position 1905, and plates 1401 and 1403 hook at position 1906,enabling the plates to exert tensile force.

In another example, springs are directly integrated within either plate1401, 1402 or 1403 as depicted in FIG. 14, instead of, or in additionto, the springs build along with each individual probe combs. FIG. 20depicts one embodiment of a plate 2003 with integrated springs 2006 thatcan individually bend to accommodate probe comb-to-probe combgeometrical variation. FIG. 20 illustrates the top view of a probe combholder. In this embodiment the probe comb holding system comprises onlytwo plates. In this embodiment, the base plate 2001 corresponds to plate1405 in FIG. 14. The base plate 2001, with oblong holes 2002, is alignedand stacked along with a top plate 2003, with smaller holes 2004. Bothplates are loosely aligned using a set of pins 2005 inserted in bothholes 2004 and 2002. The top plate 2003 is equipped with a series ofmechanical springs 2006. Each spring is connected to a structure 2007that has a characteristic triangular cut on its distal end, aspreviously seen in FIG. 16. The bottom plate 2001 is also equipped withstructure 2008 exhibiting a triangular cut as well. The only differencebetween plate 2001 and 2003 is the absence of mechanical springs inplate 2001. Vertical probe combs 2008, herein represented from the topview as a series of rectangles 2009, have been inserted vertically and aforce 2010 has already been applied to plate 2002, forcing plate 2002 tomove with reference to plate 2001. As a result, the probe combs 2012 aresqueezed on one side by structure 2007 and on the other by structure2008. In the event that probe combs 2012 have a length that vary by thefull extent of the minimum and maximum tolerances afforded by any of themachining steps that lead to the fabrication of probe combs 2012, and aslong as springs 2006 are designed to flex more or less and accommodatethe aforementioned variation in length, pushing plate 2002, withreference to plate 2001, will result in effectively pushing and securingall the probe combs, regardless of their length.

FIG. 21 presents yet another example of a plate. In this example, theplate motion is made possible thanks to the presence of a set ofsprings. The plate 2100 comprises a frame 2101, a series of springs 2102holding an inner frame 2103. The inner frame 2103 comprises a series ofsecondary springs 2104 and a series of structure with a triangular cut2105. Attached to frame 2103 is a handle 2106 which provides a means toapply a force directly to the inner frame 2103, with reference to theouter frame 2101. Structure 2100 is meant to avoid the use of oblongholes and pins in order to allow a differential movement of one plate toanother, as shown in FIG. 20.

In one embodiment, Plate 2100 is machined out of Single Crystal Silicon,using methods such as deep reactive ion etching, to create all thenecessary features described in FIG. 21. In another embodiment, all theplates, including the bottom plate depicted in FIG. 14 are machined outof Single Crystal Silicon. In one embodiment, all the parts are stackedon top of one another. In another embodiment all the parts made ofsilicon are bonded together using techniques including, but not limitedto, silicon fusion bonding, anodic bonding, gold-gold bonding, solder oreutectic bonding, etc.

Now referring to FIG. 22, a method 2200 for assembling an apparatus foruse in testing electronic devices is shown. First the probe comb holder,such as the ones describe above is prepared to receive a probe comb atstep 2205. Then at step 2210 a probe comb or a plurality of probe combsis inserted into the slot on the probe comb holder. Next, at step 2215the probe comb holder is engaged such that the holder snugly contactsthe probe combs. At this step the probe combs should have very little ifany freedom of movement within the probe comb holder, and with the useof the self alignment structures discussed above, the probe combs shouldbe automatically in proper alignment. Nevertheless, it is optionally,but preferable, to verify that the probe tips are in proper alignment asshown in step 2220. It is also optional, but preferable, to verify atstep 2225 that there is an electrical communication between each probetip and the electrical contacts exiting the probe comb holder. Theabsence of such an electrical communication will adversely affect theperformance of the testing apparatus. The probe comb can then beconnected to the diagnostic equipment at step 2230.

Now the apparatus (i.e., the probe comb holder and probe comb complex)can be used to test a DUT. At step 2235 the probe tips contact the DUTto form an electrical communication between the DUT and the diagnosticequipment. And at step 2240, the diagnostic equipment can run any testson the DUT to verify that the DUT is operating properly.

One of the benefits of the system and methods describe herein is therelative ease a defect can be repaired. In traditionally constructedprobe cards (i.e., fully constructed used MEMS), when an individualprobe is damaged, a technician must release that probe from thesubstrate, and carefully place a new probe in its place. Precisepositioning is essential, otherwise the probe tip will not be planarwith the adjacent probe tips, or worse, the replacement probe may beinstalled such that it physically interferes with the operation ofadjacent probes. Because the probe comb holders described above canaccept and fix probe combs with relative ease, when a probe is damaged,that particular probe comb can be released from the holder. At thattime, a replacement probe comb can be reinserted into the probe combholder and fixed, which will automatically align it into the properposition.

A repair or replacement method 2300 is shown in FIG. 23. First at step2305 the probe comb holder is disconnected from the diagnostic equipmentand the probe comb is disengaged so as to loosen the contact the probecomb holder has on the probe combs (step 2310). The damaged probe combs,or those that are sought to be replaced, are removed from the slot onthe probe comb holder at step 2315. The damages probe combs are eitherrepaired or replaced with new or remanufactured probe combs at step2320. At this point, the steps of inserting and engaging the probe comb(shown as steps 2325-2355) are the same as those already discussed inregards to method 2200. It is important to note that method 2300 is notlimited to the repair of damaged probes, but can also be used to replaceany probe comb.

While the description above refers to particular embodiments of thepresent invention, it should be readily apparent to people of ordinaryskill in the art that a number of modifications may be made withoutdeparting from the spirit thereof. The accompanying claims are intendedto cover such modifications as would fall within the true spirit andscope of the invention. The presently disclosed embodiments are,therefore, to be considered in all respects as illustrative and notrestrictive, the scope of the invention being indicated by the appendedclaims rather than the foregoing description. All changes that comewithin the meaning of and range of equivalency of the claims areintended to be embraced therein. Moreover, the applicants expressly donot intend that the following claims “and the embodiments in thespecification to be strictly coextensive.” Phillips v. AHW Corp., 415F.3d 1303, 1323 (Fed. Cir. 2005) (en banc).

1. An apparatus for testing an electronic device comprising: a pluralityof probes, each probe comprising a shank and a probe tip located at thedistal end of the shank, wherein the shank elastically deforms when theprobe tip contacts a device under test (DUT); a common foot connected toproximal end of each shank, the foot is capable of elastic deformationwhen the probe tip contacts the DUT; a substrate connected to the commonfoot; and a plurality of isolated electrical vertical interconnectedaccess (vias) connecting the each probe tip to the substrate, such thateach probe tip of the plurality is capable of conducting an electricalcurrent from the DUT to the substrate.
 2. The apparatus of claim 1,wherein for each of the plurality of probes, the shank is adapted toelastically deform independently of the other probes when the probe tipcontacts a device under test.
 3. The apparatus of claim 1, wherein theplurality of probes is constructed of a material consisting of the groupof copper, gold, nickel, nickel manganese, and beryllium copper.
 4. Theapparatus of claim 1, wherein a portion of the vias is the shank.
 5. Theapparatus of claim 1, wherein the common foot is comprised of tworegions, wherein the first region has a first stiffness and is connectedto the shank and the second region has a second stiffness and isconnected to the substrate, and the first and second stiffnesses aredifferent.
 6. The apparatus of claim 5, wherein the second region isstiffer than the first region.
 7. The apparatus of claim 1, wherein thevias are exposed on the outside of the shank.
 8. The apparatus of claim1, wherein a plurality of probes comprises two combs of parallel probes,wherein the combs are separated by an insulating material.
 9. Theapparatus of claim 8, wherein the insulating material is selected from agroup consisting of: a polymer, non-conductive ceramic and glass. 10.The apparatus of claim 8, wherein the combs comprise an electricalelement, wherein electrical element is selected from a group consistingof: resistors, inductors, thermocouples and resistive heaters.
 11. Theapparatus of claim 1, wherein the probe is constructed from a singlecrystal silicon.
 12. The apparatus of claim 1, wherein the substrate iscomprised of two layers of silicon with an insulating layer in between.13. The apparatus of claim 1, wherein the plurality of probes form aprobe comb.
 14. The apparatus of claim 13, wherein the probe combcomprises a first spring structure adapted to exert first force againsta probe comb holder.
 15. The apparatus of claim 14, wherein the probecomb comprises a second spring structure adapted to exert second forceagainst the probe comb holder in a direction that is substantiallyorthogonal to the first force exerted by the first spring structure. 16.The apparatus of claim 13, further comprising a probe comb holder,wherein the holder is planar and has at least one slot, and wherein theprobe comb is disposed of in the slot.
 17. The apparatus of claim 16,wherein the probe comb holder has a plurality of self alignmentstructures.
 18. The apparatus of claim 16, wherein the probe combcomprises a first spring structure adapted to exert first force againstthe probe comb holder.
 19. The apparatus of claim 17, wherein the probecomb comprises a second spring structure adapted to exert second forceagainst the probe comb holder in a direction that is substantiallyorthogonal to the first force exerted by the first spring structure. 20.The apparatus of claim 16, wherein the probe comb holder comprises aplurality of plates that slide at least partially independent of eachother, the plates adapted to restrict the movement of the probe comb.